GlobalFoundries will make AI-chip interposers for TSMC under a $2 billion deal.

GlobalFoundries reached a $2 billion, five-year agreement to manufacture silicon interposers for TSMC at its Malta, New York, plant. Interposers sit beneath processors and memory stacks in advanced packages, carrying the high-speed connections between them.

GlobalFoundries said the expanded factory should become the first US-based source of the interposers used in advanced chip packaging. Volume production is expected to begin ramping in the first half of 2028, as limited packaging capacity remains a constraint on AI-chip output.